Polyester primer for adhesively bonded substrates

ABSTRACT

Disclosed are primer compositions for enhancing the adhesion of hot-melt adhesives to substrates comprising a copolyester of at least 50 mole percent terephthalic acid, about 10-90 mole percent 1,4-butanediol or 1,6-hexanediol, and a solvating amount of a volatile solvent, the copolyester having an I.V. of about 0.3-1.5 dl/g and a melting point of about 100°-200° C.



